HUAWEI To Reveal Upcoming Flagship Kirin 990 Chipset This September 6
It seems that HUAWEI has confirm of their latest in-house chipset, the Kirin 990, which will be revealed at this year’s IFA 2019 in Berlin. The news was revealed with them uploading a teaser of the brand new SoC, which you can check out below.
With the new Kirin 990, it will feature TSMC’s 7nm EUV process, which is reported to offer 20% better transistor density as well as increased power efficiency from its predecessor.
It’s been said that it will offer the ability to offer 4K video recording at 60fps, which is something new for a Kirin chipset. Other than that, we can see from the video that there’s 5G visible on the teaser, so that’s one thing to look out for.
Though not much is revealed just yet, we can expect it to be introduced to the market with the new HUAWEI Mate 30, as it is a norm for the Mate series to come with the latest chipsets in the past.
Pokdepinion: It has been a long time coming. I simply can’t wait to see how it performs!