HONOR Magic3 Series Confirmed To Feature The New Snapdragon 888 Plus Chipset
Things seem to be looking up more and more for HONOR in recent times. Just a few weeks ago, the company confirmed that Google Mobile Services will be coming back to their smartphones with the announcement of the HONOR 50 series coming to Malaysia all but confirmed it. Now, HONOR’s President of Product Line, Fang Fei, has confirmed that the newly released Snapdragon 888 Plus chipset.
Snapdragon 888 Plus coming HONOR Magic3 series
In the statement, Ms Fang Fei stated that the platform’s industry-leading performance and gains in AI will allow Honor to create “a mobile experience that will fulfil the needs of even the most demanding users”.
The new Snapdragon 888 Plus chipset features an overclocked Kryo 680 CPU Prime core and a faster 6th Gen Qualcomm AI Engine. The AI performance has also been given an upgrade compared to the base Snapdragon 888 chip with improved performances of 23%. Gaming would be around the same though as the Snapdragon 888 Plus features the same Adreno 660 GPU. The new chip is manufactured on a 5nm process node and will feature Snapdragon X60 5G modem and FastConnect 6900 for fast wireless connectivity.
We don’t know when the Snapdragon 888 Plus-bearing HONOR Magic3 series will release. Be sure to stay tuned to us here at Pokde.net for more information.
Pokdepinion: Not gonna lie but I’m pretty excited for the HONOR Magic3 series. The first phone that I ever bought with my own money was the HONRO 3C Lite and I loved that phone to bits so I really have a huge soft spot for the HONOR brand.