LG Electronics announced that it has joined the NVIDIA Partner Network (NPN) as a Power and Cooling Solution Preferred Partner, strengthening its position in thermal management for high-density AI datacenters, led by its recently-qualified Coolant Distribution Unit (CDU) as NVIDIA DSX Ready.
LG’s 2.6MW Cooling Unit Qualifies As NVIDIA DSX Ready
LG’s 2.6-megawatt Coolant Distribution Unit (CDU) gives it the largest cooling capacity among current DSX Ready CDU partners. The company, known for home electronics products, has also completed infrastructure qualification for its 600kW and 1MW CDU models, meeting NVIDIA’s technical criteria covering cooling performance, failover capabilities, and reliability.
The CDUs use a direct-to-chip (DTC) liquid cooling approach, delivering coolant directly to CPUs, GPUs, and other heat-generating components. The units are designed to work alongside existing air-cooling infrastructure to form a hybrid cooling system.
LG’s NVIDIA-qualified CDUs will be showcased at Data Centre World Asia 2026, held 29–30 September at Marina Bay Sands in Singapore. By the end of the year, LG plans to pursue NVIDIA qualification for its 4.0MW CDU model as part of its expanding liquid cooling portfolio.
Pokdepinion: Everyone’s racing to cool AI chips these days, so a fridge and appliance company getting into liquid cooling isn’t that strange anymore.
