If the release schedule from last year is anything to go by, the HUAWEI Mate 70 series is expected to launch soon. Although the rumor mill has been unusually quiet about the Mate 70 Pro, a recent leak suggests some notable design and hardware changes compared to the Mate 60 Pro.
HUAWEI Mate 70 Pro Leaked
The leak primarily focuses on the rear design and camera bump. While the cameras remain arranged in a circular formation, the new design features a thicker outer glass ring. Additionally, the LED flash has been repositioned to the bottom of the ring, accompanied by a new inscription reading “AI-DC.” This writing could hint at enhanced image processing capabilities powered by artificial intelligence.
As anticipated, the Mate 70 Pro is expected to run on a new Kirin 9100 chipset, offering improved performance and efficiency. The main camera also sees an upgrade, with the Mate 70 Pro set to feature a 60 MP main sensor, up from the 50 MP unit found in the Mate 60 Pro. The 12 MP ultrawide shooter and the 48 MP 5x periscope telephoto camera are expected to remain the same, at least on paper.
On the front, HUAWEI is upgrading the selfie camera as well. The Mate 70 Pro will reportedly sport a 48 MP sensor, replacing the older 32 MP unit. This will be complemented by a 3D ToF sensor for advanced facial recognition, promising more secure and accurate face unlock capabilities.
Pokdepinion: I don’t really know how to feel about the supposed design change, seems like it will practically be the same at the end of the day instead of a major redesign but maybe I might feel differently if I see it live in person.
