MediaTek Dimensity 9300 Announced – A Challenger to Qualcomm’s Snapdragon 8 Gen 3
The competition in the world of smartphone chipsets is heating up with MediaTek’s latest flagship, the Dimensity 9300. This powerful chipset is poised to take on Qualcomm’s Snapdragon 8 Gen 3, which is set to power the next wave of Android flagships from Chinese smartphone manufacturers.
MediaTek Dimensity 9300 Announced
One of the standout features of the Dimensity 9300 is its all-big core CPU design. It includes a prime Cortex-X4 core clocked at 3.25GHz, along with 3 Cortex-X4 cores at 2.85GHz and 4 Cortex-A720 cores at 2.0GHz, all based on the Armv9 architecture. MediaTek claims that this configuration results in a 40% improvement in peak performance compared to its predecessor, the Dimensity 9200, while using 33% less power.
The chipset also boasts a 12-core Immortalis-G720 MC13 GPU with hardware-based ray tracing, offering a 46% improvement in performance and 40% less power consumption. It supports the latest LPDDR5T RAM at impressive speeds of 9,600Mbps and UFS 4.0 storage with Multi-Circular Queue (MCQ) support.
For AI tasks, the Dimensity 9300 relies on the APU 790, which supports Generative AI with Stable Defusion generation in less than one second and provides support for Large Language Models (LLM) with up to 33 billion parameters. The chipset is compatible with screens featuring up to WQHD resolution and 180Hz refresh rates, making it an ideal choice for foldable devices with dual-active displays.
On the imaging front, the Dimensity 9300 features the Imagiq 990 ISP with always-on HDR and a dedicated image stabilization module. This ISP can handle up to 8K video at 30 fps or 4K at 30/60 fps with cinematic mode and real-time bokeh effects. Additionally, the R16 5G modem supports both Sub-6GHz and mmWave bands with improved power efficiency thanks to MediaTek’s UltraSave 3.0+ technology.
|Dimensity 9200||Dimensity 9300||Snapdragon 8 Gen 3|
|CPU Prime||1x Cortex-X3 @ 3.05GHz||1x Cortex-X4 @ 3.25GHz||1x Cortex-X4 @ 3.3GHz|
|CPU Big||3x Cortex-A715 @ 2.85GHz||3x Cortex-X4 @ 2.85GHz +||3x Cortex-A720 @ 3.2GHz +|
|4x Cortex-A720 @ 2.0GHz||2x A720 @ 3.0GHz|
|CPU Little||4x Cortex-A510 @ 1.8GHz||–||2x Cortex-A520 @ 2.3GHz|
|GPU||Immortalis G715||Immortalis G720||Adreno 740|
|5G||sub-6GHz/mmWave (7.9Gbps)||sub-6GHz/mmWave (7.9Gbps)||sub-6GHz/mmWave (10Gbps)|
|Wi-Fi||Wi-Fi 7 (6.5Gbps)||Wi-Fi 7 (6.5Gbps)||Wi-Fi 7 (5.8Gbps)|
|Bluetooth||BT 5.3||BT 5.4||BT 5.4|
|Camera||320MP, 18-bit ISP||320MP, 18-bit ISP||200MP, 18-bit ISP|
|Video||8K @ 30fps, 4K @ 60fps||8K @ 30fps, 4K @ 60fps||8K @ 30fps, 4K @ 120fps|
The Dimensity 9300 is set to debut in vivo’s X100 series, launching in China. As the days progress, we can anticipate more Android smartphone manufacturers pledging their allegiance to this formidable chipset. Stay tuned for the latest developments in the world of mobile technology.
Pokdepinion: It’s going to be an interesting fight next year, not just from a performance standpoint but also on the value aspect. If the Dimensity 9300 can come close to the Snapdragon 8 Gen 3 but still have the devices powering it be at a noticeably lower price point, it’s going to cause a big shift in the market.