MediaTek Introduces Dimensity 9400+ SoC With Minor Spec Bump

Low Boon Shen
2 Min Read

MediaTek has announced the launch of its latest flagship chipset, the Dimensity 9400+, which is a minor spec bump on top of the Dimensity 9400 launched last year. Like the 9400, the 9400+ features the same 1+3+4 core layout, albeit the prime core (Cortex-X925) is now bumped 110MHz higher to 3.73GHz.

MediaTek Dimensity 9400+

Outside of that, the GPU are identical to the non-Plus variant, meaning the same Immortalis-G925 GPU; and while NPU 890 remains the same, it gained Speculative Decoding+ (SpD+) feature that is said to provide “20% faster agentic AI performance”. Memory support the same as before, up to LPDDR5X-10667, while storage support remains on UFS 4.0 standard.

The Dimensity 9400+ is equipped with the Imagiq 1090 image signal processor (ISP) supporting 320MP camera sensor resolution, while connectivity enhancements in include extended phone-to-phone direct Bluetooth range of up to 10 kilometers, BeiDou satellite support with a 33% faster time to first fix (TTFF), along with Wi-Fi 7 and Bluetooth 6.0 support. It also supports displays up to WQHD+ (1440p+) 180Hz with tri-fold configurations.

Smartphones powered by the MediaTek Dimensity 9400+ are expected to become available in the market later this month, according to the company’s announcement.

Pokdepinion: The next wave of flagship smartphones should see this chip powering them.

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