Snapdragon 875 enters production on TSMC’s 5nm EUV node
The Snapdragon 875 is probably still a whole year away from debuting in a smartphone, but TSMC is already churning out the chipsets for Qualcomm. This comes after TSMC has rapidly increased the production capacity of their 5nm node to nearly 60 000 wafers per month, an impressive 10% bump up from last month’s capacity.
Qualcomm will be making the Snapdragon 875 chipsets along with Snapdragon X60 5G modems at TSMC’s Nanke 18 foundry. They have reportedly ordered around 6000 to 10 000 5nm wafers per month from TSMC, and is expecting to accept delivery of the chips in September. Perhaps Qualcomm is hoping to unveil Snapdragon 875 smartphones by Christmas?
TSMC also lists AMD, Apple and NVIDIA among its big clients, so we can probably expect to see 5nm chips from them by next year as well. AMD is expected to order over 20 000 wafers from TSMC for their upcoming CPUs and GPUs, which is 33% of their current production capacity.
Pokdepinion: And yet I can barely afford any other Snapdragon 865 smartphone other than the POCO F2 Pro…