Intel, TSMC and Samsung are working on UCIe packaging standards
Intel, TSMC, Samsung and more are collaborating on a new packaging standard dubbed UCIe.
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March 24, 2021
Intel pumps $20 billion investment into two new fabs to amp up chip production
Intel has just announced their plans to add two new fabs and also open up their foundries to other chipmakers.
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June 28, 2020
Intel Core i5-L16G7 underwhelms when compared to Snapdragon 8cx
Early benchmarks of the Intel Core i5-L16G7 reveals rather underwhelming results, even when compared against last year's Snapdragon 8cx.
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June 11, 2020
Intel Lakefield arrives to tackle Arm-based PCs
Intel finally announces the Lakefield platform to tackle Arm-based PCs, with the Core i5-L16G7 and Core i3-L13G4 offering five CPU cores and up to 64 GPU cores.
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HONOR X7b 5G Launching On 22 April, Alongside Other Devices
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HUAWEI Unveils MateBook X Pro 2024 with Intel Core Ultra 9 – “Lighter Than Light”
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Apple & HONOR Made Huge Gains In M’sia Smartphone Market, Samsung & OPPO Tanks
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Canon PIXMA G3770 Review – Cheap In The Long Run
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iPad Pro OLED Details Revealed in iPadOS 17.5 Firmware Leak
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ASUS Officially Debuts Redesigned Vivobook S Series Laptops In Malaysia
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Final Fantasy 7 Rebirth Review – 1997 Meets 2024, Expanded Beyond Belief
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Latest Intel Arrow Lake CPU Sightings Prove Hyperthreading Is No More
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65″ Samsung S95C OLED TV + HW-Q800C Soundbar: The Ultimate Home Entertainment Setup?
