Western Digital successfully develops 64-layer 3D NAND technology
SSD prices have been gradually dropping, and manufacturers are going towards 3D NAND to further drive prices down with higher density per chip. To that end, Western Digital has announced their success at developing their next generation 3D NAND technology, BiCS3, with 64 layer of vertical storage capability.
BiCS3 will feature TLC technology for high capacity at attractive costs. BiCS3 was developed in partnership with Toshiba, and will be initially be deployed in 256Gb (32GB) capacities, with plans for up to 512Gb (64GB) per chip. Western Digital aims to ship BiCS3 chips for retail markets in Q4 2016, with OEM sampling to begin this quarter.
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