Dimensity 9300 Chip Is Said To Be 10% Faster Than Snapdragon 8 Gen 3

Aiman Maulana
3 Min Read
Dimensity 9300 Chip Is Said To Be 10% Faster Than Snapdragon 8 Gen 3

As the world of mobile processors continues to evolve, Mediatek is gearing up to launch its highly anticipated Dimensity 9300 chipset, and recent leaks have provided some intriguing insights into this upcoming powerhouse. Digital Chat Station, a trusted source for mobile tech leaks, has shared valuable information about the Dimensity 9300, giving enthusiasts a taste of what’s to come.

Dimensity 9300 Chip Could Be 10% Faster Than Snapdragon 8 Gen 3?

Dimensity 9300 Chip Is Said To Be 10% Faster Than Snapdragon 8 Gen 3

The Dimensity 9300 chipset is set to take the mobile industry by storm with its unique architecture. Previous reports from Digital Chat Station indicated that this chipset would feature four Cortex-X4 cores and four Cortex-A720 units. Notably, there are no low-power Cortex-A520 cores included, which is a significant departure from conventional chipsets.

The latest leak goes a step further by revealing the CPU clock speeds, which are truly impressive. According to this information, the Dimensity 9300 will outperform the Qualcomm Snapdragon 8 Gen 3 by a remarkable 10%. This competitive edge in performance is bound to catch the attention of tech enthusiasts and smartphone users alike.

So, what’s under the hood of the Dimensity 9300? Mediatek appears to have adopted a 1+3+4 architecture for this chipset. This configuration comprises one Cortex-X4 core clocked at 3.25 GHz, three Cortex-X4 cores running at 2.85 GHz, and four Cortex-A720 cores operating at 2.0 GHz. The inclusion of the Immortalis-G720 GPU further bolsters the Dimensity 9300’s capabilities.

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In contrast, Qualcomm’s Snapdragon 8 Gen 3 employs a 1+5+2 setup. It features one Cortex-X4 core clocked at 3.19 GHz, five Cortex-A720 cores running at 2.96 GHz, and two Cortex-A520 cores operating at 2.27 GHz. This unique arrangement by Mediatek, particularly the absence of low-power cores, marks a bold step in chipset design.

The absence of low-power cores in the Dimensity 9300 suggests a focus on delivering raw power and performance. This unconventional approach raises intriguing questions about real-world performance and thermal management. Will smartphone manufacturers be able to harness the full potential of this chip while avoiding overheating issues? The answer remains to be seen, but the Dimensity 9300’s potential is undeniably vast.

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Pokdepinion: Being faster is one thing, being reliable is another. It needs to have a strong impact if it wants to make consumers be willing to give their chip a try, especially given Qualcomm’s dominance in the SoC arena.

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