MediaTek Dimensity 9300 Has an Unusual Configuration to Combat the Snapdragon 8 Gen 3
The MediaTek Dimensity 9300 chipset has been causing quite a stir in the tech world, thanks to its intriguing configuration. Recent rumors, shared by the tipster Digital Chat Station on the Chinese social media platform Weibo, have shed light on the chipset’s potential to be a real powerhouse. According to these rumors, the Dimensity 9300 will feature an unconventional setup, including 1 Cortex-X4 prime CPU core, 3 Cortex-X4 prime CPU cores, and 4 Cortex-A720 performance CPU cores, with no efficiency cores in sight. Complementing this CPU arrangement, the chipset will boast Arm’s Immortalis G720 MC12 GPU.
MediaTek Dimensity 9300 Has an Unusual Configuration
While specific benchmark scores for the Dimensity 9300 are yet to be officially disclosed, Digital Chat Station has hinted at its impressive performance. According to the leaks, on AnTuTu version 10, the Dimensity 9300 managed to outscore both the CPU and GPU performance of the upcoming Snapdragon 8 Gen 3 SoC. What’s even more intriguing is that the Dimensity 9300 is crafted using TSMC’s N4P process node, an optimized 5nm process. TSMC claims that the N4P process delivers an 11% performance boost compared to the original N5 5nm process.
The N4P node on which the Dimensity 9300 is based brings significant enhancements, including a 22% improvement in power efficiency, a 6% increase in transistor density, and a 6.6% performance bump compared to the earlier N4 process. As a result, the Dimensity 9300 chipset is expected to offer a 15% performance boost over its predecessor, the Dimensity 9200, while simultaneously reducing power consumption by 40%.
The much-anticipated Dimensity 9300 is anticipated to make its debut within the Vivo X100 series, slated for release in the coming month. Considering the fierce competition in the application processor market expected in the first quarter of 2024, the Dimensity 9300’s arrival is highly anticipated. This market is already heating up with the introduction of the A17 Pro, the first 3nm smartphone chipset, powering the iPhone 15 Pro and iPhone 15 Pro Max. As for the Dimensity 9300, it’s poised to become the powerhouse behind the Vivo X100 series before the end of 2023.
Moving into the first quarter of the following year, the Snapdragon 8 Gen 3 for Galaxy and the Exynos 2400 (yes, it’s part of the conversation) will be at the helm of Samsung’s flagship Galaxy S24 lineup. Speaking of the Exynos 2400 SoC, it stands out with its unique deca-core configuration.
Pokdepinion: As long as overheating concerns are addressed with these chipsets, smartphone enthusiasts have much to look forward to. The initial alarm regarding overheating with the iPhone 15 Pro line turned out to be a software-related issue unrelated to the A17 Bionic chip. Furthermore, MediaTek has clarified that reports of overheating with the Dimensity 9300 are baseless, and while concerns remain about the Exynos 2400 due to Samsung’s history, only time will tell how these chipsets perform in real-world usage.
