realme Unveils GT Neo 3 Powered by MediaTek Dimensity 8100 5G
realme Releases First Smartphone That Features MediaTek Dimensity 8100 5G
realme recently released the latest phone in the GT family, the realme GT Neo 3, to Malaysian customers. Thanks to its MediaTek Dimensity 8100 5G CPU, realme users will be able to experience all-day power and seamless performance on the device beginning 15 June 2022.
realme unveils another trendy design for their current GT series, maintaining their series of stylish products that represent the vibrant and colourful spirits of their young audience globally. The back cover of the GT Neo 3 features a racing stripe design as a representation of the complete incredible speed of this all-new smartphone.
The GT Neo 3 is built with the MediaTek Dimensity 8100 5G chipset, delivering stabilized and sustainable power performance, and is the first in Malaysia to deploy this chipset in a smartphone. The chipset, an improvement from its predecessor, includes a number of enhancements that give consumers the sense of the dual-chip gaming-level flagship.
The chip’s power-saving technology improves the overall performance of the device’s improved features, such as its Dedicated Display Chipset. The phone provides gamers with an upgraded experience of the highest power efficiency with all of the latest enhancements, allowing for an uninterrupted, vivid gaming experience.
The GT Neo 3 which features 8GB RAM with 256GB storage will cost RM2,099 and will be on discount for RM1,799 from 15 to 17 June on realme’s official Lazada Store.
For more information about the launch, stay tuned to realme Malaysia’s official Facebook page.
Pokdepinion: First smartphone powered by MediaTek’s latest chip. I wonder how the chipset will fair against Snapdragon in terms of heavy usage such as gaming. Looking forward to seeing the improvements from the Dimensity 8000! Also, phone design somehow gives me Sonic vibes.