PS5 Patent Reveals Liquid Metal Cooling for Better Performance

The PS5 launch is getting closer and closer. Now, a new patent filed by Sony has been made known, which reveals a liquid cooling technique for the PlayStation 5 console which will improve the thermals and in turn, the performance.

Liquid Metal Cooling for the PS5

The liquid metal cooling patent for the PS5 was actually filed last year but only revealed recently. It will see the use of various metal alloys, including silver and copper, that will be in liquid form at room temperature. Apart from that, the seals would contain liquid metal made of ultraviolet cured resin that is ensured to not leak into the system.

If you’re familiar with computer components, then you would have an idea by now that the liquid metal is being used as a replacement for the usual thermal paste and applied to the heatsink itself. It conducts heat better than thermal paste, which makes it ideal if you want to improve the thermals of the machine. There will still be fans in the PS5 for airflow and venting the heat out of the console.

Here’s an excerpt from the patent explaining more about the liquid metal cooling:

When the heat generation amount of the semiconductor chip increases, it becomes difficult to sufficiently cool the semiconductor chip due to the thermal resistance possessed by the grease. In the semiconductor device…a metal liquefied by heat at the time of operation of a semiconductor chip is used as a heat conductive material between the semiconductor chip and the radiator in place of grease. When such a metal is used, the thermal resistance between the semiconductor chip and the radiator is lowered, and the cooling performance of the semiconductor chip can be improve.

​In a structure using a metal having fluidity as a heat conductive material, in order to sufficiently exhibit cooling performance, it is important to limit a range in which the heat conductive material spreads even when a posture change or vibration of the semiconductor device occurs. Furthermore, when the heat sink is pressed against the semiconductor chip, it is important that the force acts sufficiently on the semiconductor chip. That is, adhesion between the semiconductor chip and the radiator is also important.

As this is merely a patent and not something Sony is promoting, at least not yet, we’re uncertain if they will be applying this method for the PS5. Given that we’re getting closer to launch and we’re certain that the PlayStation team would like to take any and every avenue to prevent heat-related issues, we wouldn’t be surprised to see this actually being used.

For now, the PlayStation 5 is still slated for a Holiday 2020 release, with no specific release date and pricing available yet. We will be reporting more on this as soon as information becomes available so stay tuned.

Source

Pokdepinion: With major brands ditching the usual thermal paste in favour of liquid metal, it’s no surprise that console makers will do the same. After all, it is a better heat conductor.