Intel’s 10nm-based Lakefield processors will go toe-to-toe versus Qualcomm’s Snapdragon chipsets

Hold your horses, this is not going to be a processor for your high-performance desktop. This will be Intel’s first hybrid CPU, designed for power efficiency and a small package. It will probably find its home inside Always-Connected PCs, a market which Qualcomm has been conquering with their high-performance Snapdragon chipsets.

Intel will be using a big.LITTLE configuration here as well, with one high performance Sunny Cove CPU core mated to four other smaller, high efficiency cores. Intel will be using their latest 10nm manufacturing process for these cores, as previously detailed. The GPU will also be 10nm-based.

Lakefield will be based on a chiplet design, whereby the cores, GPUs, cache and I/O can be manufactured on separate nodes for cost-effectiveness. It also means that Intel can swap out certain components for better flexibility in their product stack without having to design a whole new chip.

This will be Intel’s first chipset to tout Intel’s Foveros 3D packaging technology, allowing for a complete system-on-chip in just 12mm² of space. Intel promises great efficiency and performance, which should make it perfect for portable Always-Connected PCs.

Intel expects to be able to release the Intel Lakefield platform within 2019, as it is slated to enter production this year. Are you looking forward to Intel’s competition for the Qualcomm Snapdragon chipsets for Always-Connected PCs?

Pokdepinion: Intel’s history with their efficiency-focused chipsets have been quite questionable, but perhaps Lakefield will be different this time around?