[COMPUTEX 2026] AGI Technology Showcases New RAM & Storage Solutions, Including New DAN DA DAN Crossover

AGI Technology held its showcase of memory and storage products in COMPUTEX 2026 that has expanded into new categories since our last visit in 2025. Notably, it’s bringing Japanese manga series DAN DA DAN onboard for some of its consumer products with special designs.

AGI Technology @ COMPUTEX 2026

As makers of RAM and storage products, it’s probably a no-brainer for brands like AGI to expand into AI infrastructure and edge computing segments. For starters, the company introduced its DDR5 RDIMM server memory series, available in 32GB and 64GB capacities with speeds of 5600MT/s and 6400MT/s; AGI stated that the memory modules utilize screened original ICs to ensure stability and signal integrity during continuous high-workload operations.

The head-turning bit is the featured collaborations of the popular Japanese manga series DAN DA DAN, with its characters and designs featured on AGI’s DRAM modules, SD cards, SSDs – both internal and external – like the new ED268 Rugged External SSD, which combines 20Gbps USB-C connectivity with durability features such as IP-rated ingress protection and up to 2 meters of drop resistance.

That said, allow us to be the bearer of bad news: it won’t be available in Malaysia. (We hope they do, eventually.) Currently, these will be sold in its home market Taiwan, along with two of our fellow Southeast Asian brethren, Vietnam and the Philippines. Either way, we think this is a bit of a masterstroke from the Taiwanese company to make its presence properly known.

There’s also another unusual design from the company that involves “patented thermochromic heat-dissipation memory”. We’ve seen its use in smartphones before, such as the special GoT Edition realme 15 Pro, where temperature changes causes the pigments to change colors. This will cost extra if it does launch into the market, though, and memory isn’t exactly a cheap commodity right now.

The exhibitor says this has a practical benefit in allowing the user to easily see the module’s temperature without sifting through sensor data from tools like HWiNFO, and we see their point; while they also had a similar demonstration on a sparsely-labeled SSD (see above), there’s just no usefulness in such cases as the drive is almost exclusively tucked beneath the motherboard’s heatsinks in practice.

Pokdepinion: The thermochromic bit might be genuinely useful, we think.

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