Redmi K70 Geekbench Run Showcases MediaTek Dimensity 8300’s Power
Xiaomi’s anticipated Redmi K70 is making headlines as it gears up to be one of the first smartphones featuring MediaTek’s upcoming Dimensity 8300 chip. While the official announcement is just around the corner, a recent Geekbench run for the Redmi K70, with the codename Xiaomi 2311DRK48C, provides a sneak peek into the device’s performance.
Redmi K70 on Geekbench
The Geekbench scores reveal an impressive performance for the Redmi K70. It secured 1,512 single-core points and 4,886 multi-core points, showcasing a slight improvement over the outgoing Dimensity 8200 and 8200 Ultra. The Dimensity 8300 employs a 1+3+4 architecture with ARMv8-based cores, featuring a powerful Cortex-A715 performance core clocked at 3.35GHz, 3x Cortex-A715 cores @ 3.32GHz, and 4x Cortex-A510 efficiency units @ 2.2GHz. Complementing the processing power is the Mali-G615 MC6 GPU for enhanced graphics performance.
The listing also unveils other key specifications of the Redmi K70. The device will boast an impressive 16GB of RAM, ensuring smooth multitasking experiences. Operating on the cutting-edge Android 14, the Redmi K70 is anticipated to come with Xiaomi’s custom interface, HyperOS, straight out of the box.
While there is no official confirmation from Xiaomi regarding the launch date, expectations are high for a soon-to-be-revealed release. Additionally, enthusiasts can anticipate a Pro model, equipped with the Snapdragon 8 Gen 3 chip, adding further excitement to Xiaomi’s upcoming smartphone lineup. Stay tuned for more updates as Xiaomi prepares to unveil its latest offerings to the eager smartphone market.
Pokdepinion: I’m sure most people will have their eyes glued to the Snapdragon 8 Gen 3 version, but I wouldn’t sleep on this just yet. We might see some interesting data coming out of a comparison of both.
