REDMAGIC 8S Pro is coming to Malaysia - with three versions available, all featuring the new overclocked SD8G2 chipset, a first outside of Samsung Galaxy S23.

MediaTek has announced its latest chipset, the Dimensity 9200+, which outperformed Snapdragon 8 Gen 2 in preliminary tests. The boosted version of last year’s Dimensity 9200 features higher CPU clocks, 17% GPU boost, and more.

The ROG Phone 7 series has officially arrived in Malaysia - with early bird gifts available on the roadshow at Pavilion Bukit Jalil and ROG ESTORE, while stocks last.

New leaks of a snap-on plastic case for Samsung's Z Flip5 confirm its larger cover display, measuring 3.4 inches with a resolution of 720 x 748 pixels. The flip phone is set to debut in July alongside the Z Fold5, Tab S9, and Watch6.

The Dimensity 9200+, MediaTek's upcoming top-end chipset, has already outperformed the Snapdragon 8 Gen 2, according to leaked Geekbench 6 scores. Read on to find out more about its impressive multi-core and single-core performance.

The upcoming vivo X Fold2 foldable flagship smartphone was recently spotted on Geekbench with some impressive specs. It is expected to launch in China on April 20, along with the X Flip and Pad 2.

Get the latest scoop on the upcoming Samsung Galaxy Tab S9 Ultra, including details on its chipset, battery, and physical dimensions.

The US models of the upcoming Samsung Galaxy Z Fold5 and Galaxy Z Flip5 are set to feature Qualcomm Snapdragon 8 Gen 2 for Galaxy chipset, according to Geekbench listings.

Vivo's upcoming X Fold2 has appeared on AnTuTu, revealing its performance specifications. The foldable phone is equipped with the Snapdragon 8 Gen 2 chipset, 12GB RAM, and 512GB storage.

ASUS ROG Phone 7, the latest gaming smartphone in the ASUS Republic of Gamers lineup, is set to be unveiled at an event on April 13. Get a sneak peek at what to expect, including specs and features.